UL 796F
Standard for Flexible Materials Interconnect Constructions

DETAILS
Edition Number:3SCC Approved:--
Edition Date:2015-08-28DOD Approved: --
Price Code:CANSI Approved: 2016-03-16
Type:ulstd

  • SCOPE

    1.1 Scope

    1.1.1 These requirements apply to flexible material printed wiring board constructions (FMIC’s) for use as components in flexible, flex-to-install, rigid, and multilayer rigid-flex composite applications with and without stiffener and adhesive materials in devices or appliances.

    1.1.2 Together with the Standards mentioned in the Supplementary Test Procedures, 1.3, these requirements provide data with respect to the physical, electrical, flammability, thermal, and other properties of the FMIC under consideration and are intended to provide guidance to the fabricator, end product manufacturer, safety engineers and other interested parties.

    1.1.3 Compliance with these requirements does not indicate the product is acceptable for use as a component of an end product without further investigation.

    1.1.4 The singlelayer and multilayer flexible, flex-to-install, and multilayer rigid-flex composite constructions addressed by these requirements consist of conductors affixed to base material, with mid-board interconnections, and cover materials.

    1.1.5 The suitability of additional stiffener and adhesive materials, not evaluated in accordance with Stiffener and adhesive (external bonding) materials, 2.9, the Stiffener bond strength test, 5.12, and Flammability tests, 5.15, are subject to the applicable end-use product construction and performance requirements. See Additional stiffener and adhesive (external bonding) materials, 7.12, for marking requirements for FMIC’s provided with additional stiffener and adhesive materials not investigated.

    1.1.6 The requirements for rigid printed wiring boards are in the Standard for Printed Wiring Boards, UL 796.

  • TABLE OF CONTENTS
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    • Cover
    • Transmittal
    • Table of Contents
      • Body
        • 1 Introduction
          • 1.1 Scope
          • 1.2 Units of measurement
          • 1.3 Supplementary test procedures
          • 1.4 References
          • 1.5 General
          • 1.6 Glossary
          • 1.7 Abbreviations
        • 2 Materials
          • 2.1 General
          • 2.2 Base materials
          • 2.3 Conductors and conductor adhesives
          • 2.4 Bonding film (supported and unsupported) and internal bonding materials
          • 2.5 Cover material (coverlay, coverfilm and covercoat)
          • 2.6 Solder resist, solder mask, and permanent coatings
          • 2.7 Plugged-hole materials
          • 2.8 High density interconnect (HDI) dielectric materials
          • 2.9 Stiffener and adhesive (external bonding) materials
        • 3 FMIC Constructions
          • 3.1 General
          • 3.2 Singlelayer (dielectrics)
          • 3.3 Multilayer (dielectrics)
          • 3.4 Flexible
          • 3.5 Flex-to-install
          • 3.6 Rigid
          • 3.7 Multilayer rigid flex composite
          • 3.8 Flammability classification only
          • 3.9 Glossary of construction and FMIC titles
        • 4 Processes
          • 4.1 General
          • 4.2 Process description
          • 4.3 Variations in processes
        • 5 Tests
          • 5.1 General
          • 5.2 Microsection analysis
          • 5.3 Thermal stress test
          • 5.4 Delamination test
          • 5.5 Plating adhesion test
          • 5.6 Bond strength test
          • 5.7 Conductive paste adhesion test
          • 5.8 Coverlay test
          • 5.9 (Ambient) bend test
          • 5.10 Cold-bend test
          • 5.11 Repeated flexing test
          • 5.12 Stiffener bond strength test
          • 5.13 Silver migration test
          • 5.14 Dissimilar Dielectric Materials Thermal Cycling Test
          • 5.15 Flammability tests
          • 5.16 Direct support requirements (DSR) tests
        • 6 Parameter Profile Indices
          • 6.1 General
          • 6.2 Maximum operating temperature (MOT)
          • 6.3 Flammability classification
          • 6.4 Solder limits
          • 6.5 Thickness
          • 6.6 Conductor weight
          • 6.7 Conductor width
          • 6.8 Maximum area conductor diameter
          • 6.9 Direct support requirements (DSR)
        • 7 Markings
          • 7.1 General
          • 7.2 Type designation
          • 7.3 Trademark
          • 7.4 Manufacturer identification
          • 7.5 FMIC category constructions
          • 7.6 Flammability classification
          • 7.7 Flammability classification only constructions
          • 7.8 Direct support requirements (DSR)
          • 7.9 Comparative tracking index (CTI)
          • 7.10 System component symbol (SCS)
          • 7.11 Size class number (SCN)
          • 7.12 Additional stiffener and adhesive (external bonding) materials