UL 796
Standard for Printed-Wiring Boards

DETAILS
Edition Number:11SCC Approved:--
Edition Date:2016-05-31DOD Approved: 1995-01-20
Price Code:CANSI Approved: 2016-05-31
Type:ulstd

  • SCOPE

    1 Scope

    1.1 These requirements apply to rigid printed-wiring boards and flexible printed-wiring board for use as components in devices or appliances. Compliance with these requirements does not indicate that the product is acceptable for use as a component of an end product without further investigation.

    1.2 The flexible printed-wiring boards covered by these requirements consist of conductors affixed to insulating base film, with or without a cover-lay film, with midboard connections.

    1.3 These requirements do not cover flexible printed-wiring boards of laminated-film construction in which the conductors are parallel to each other and are completely covered by the base film with only point-to-point end connections.

    1.4 These requirements do not apply to flexible, flex-to-install, rigid, and multilayer rigid flex composite interconnect constructions with and without stiffener and adhesive materials as flexible materials interconnect constructions (FMIC's) for use as components in devices or appliances – that are covered by the Standard for Flexible Materials Interconnect Constructions, UL 796F.

  • TABLE OF CONTENTS
    Expand All

    • Cover
    • Transmittal
    • Table of Contents
      • Body
        • INTRODUCTION
          • 1 Scope
          • 2 Glossary
          • 3 Units of Measurement
          • 4 Measurement Accuracy and Testing Conditions
          • 5 Supplementary Test Procedures
          • 6 References
          • 7 General
        • CONSTRUCTION
          • 8 General
          • 9 Base Materials
            • 9.1 General
            • 9.2 Metal-clad base material
            • 9.3 Direct support
          • 10 Conductors
            • 10.1 Materials
            • 10.2 Silver
            • 10.3 Conductive coating
            • 10.4 Edges and width
            • 10.5 Pattern surfaces
            • 10.6 External copper foil or cladding process weight
            • 10.7 Midboard conductor
            • 10.8 Edge conductor
            • 10.9 Maximum unpierced conductor area
            • 10.10 Contact surface plating
            • 10.11 Plated-through holes
            • 10.12 Additional conductive plating
            • 10.13 Solder limits
            • 10.14 Pattern
          • 11 Adhesives for Conductor Bonding
          • 12 Processes
            • 12.1 General
            • 12.2 Multiple-site processing
          • 13 Permanent Coatings
            • 13.1 General
            • 13.2 Permanent coatings program
          • 14 Plugged-Hole Materials
          • 15 Embedded Components
          • 16 Singlelayer (Singlesided and doublesided) Printed-Wiring Boards
            • 16.1 General
            • 16.2 Metal-clad (MCIL/CCIL) base material program
          • 17 Multilayer Printed-Wiring Boards
            • 17.1 General
            • 17.2 Assembly
            • 17.3 Mass laminate printed wiring boards
            • 17.4 Electrical insulation
            • 17.5 Laminations
            • 17.6 Dissimilar dielectric materials evaluation
            • 17.7 Interlayer connections
            • 17.8 Metal-clad laminate and prepreg materials
          • 18 Metal Base Printed-Wiring Boards
            • 18.1 General
            • 18.2 Vertical flammability evaluation for metal base PWBs
            • 18.3 Bond strength evaluation for metal base PWBs
          • 19 Flexible Printed-Wiring Boards
          • 20 Variations In Printed-Wiring Board Construction
        • PERFORMANCE
          • 21 Test Samples
          • 22 Data Collection
          • 23 Microsection Analysis
            • 23.1 General
            • 23.2 Test samples
            • 23.3 Etching the sample surface
            • 23.4 Material and test pattern parameter examination
          • 24 Thermal Shock
          • 25 Flammability
            • 25.1 General
            • 25.2 Samples
            • 25.3 Conditioning
          • 26 Bond Strength
            • 26.1 After thermal shock
            • 26.2 As received
            • 26.3 Oven conditioning
          • 27 Delamination and Blistering
          • 28 Dissimilar Dielectric Materials Thermal Cycling Test
            • 28.1 General
            • 28.2 Thermal cycling
          • 29 Plating Adhesion
          • 30 Conductive Paste Adhesion Test
          • 31 Dielectric Materials Intended for Use in Fabricating High Density Interconnect (HDI) Type Constructions
            • 31.1 General
            • 31.2 HDI Vertical flammability evaluation
            • 31.3 HDI Bond strength, delamination and blistering evaluation
            • 31.4 Test programs for HDI PWB construction variations
          • 32 Silver Migration Test
            • 32.1 General
            • 32.2 Procedure
            • 32.3 Results
        • MARKINGS
          • 33 General
    • FOLLOW-UP INSPECTION