1 Scope

1.1 These requirements apply to rigid printed wiring boards and flexible printed wiring board for use as components in devices or appliances. Compliance with these requirements does not indicate that the product is acceptable for use as a component of an end product without further investigation.

1.2 The flexible printed wiring boards covered by these requirements consist of conductors affixed to insulating base film, with or without a cover-lay film, with midboard connections.

1.3 These requirements do not cover flexible printed wiring boards of laminated-film construction in which the conductors are parallel to each other and are completely covered by the base film with only point-to-point end connections.

1.4 Flexible material constructions and multilayer rigid flex composite interconnect constructions with and without stiffener and adhesive materials shall be investigated in accordance with the Standard for Flexible Materials Interconnect Constructions, UL 796F.

SUMMARY OF TOPICS:

This revision of ANSI/UL 796 dated March 30, 2022 includes the following changes in requirements:

• Clarification of Via Hole Requirements in 10.11, 14.1, and Figure 10.1 and Figure 10.3

• Clarification of Embedded Component Requirements in Figure 10.1 and 15.3, 15.3A, 15.3B, Based on Table 22.9

• Clarification of Representative Test Pattern in 23.2 for Figure 10.1

• Clarification of Data Collection for Non-Uniform Samples; 24.8