Summary of Topics s796_12_sum.htmlSUMMARY OF TOPICS:
This new edition of ANSI/UL 796 includes the following changes:
Revisions to the Definitions to Align with Industry Use
Clarify Stabilization Period Requirements
Clarify the Title of Table 9.3 Based on Changes in UL 746E
Update Reference for Figure 10.1
Clarify the Multiple Types of Multilayer Printed Wiring Boards and Define the Hybrid PWB Requirements in New Section 18
Move the Current Requirements for HDI Printed Wiring Boards to New Section 19
Clarify Current Requirements for Metal Base Printed Wiring Boards
Relocate Figures 21.1 – 21.15 to new Annex A
Clarify Microsection Analysis Process Based on Changes to the Referenced IPC Test Method
Clarification of Requirements for Solder Limit Evaluation for Laminates and PWBs
Add Evaluation for Conductive Coins
Clarify Conductor Pattern Requirements in Clause 10.7.1 and Figure 10.1
Clarify Thermal Stress Conditioning for Conductive Paste Adhesion Test
Editorial Update: Correct the spelling of Dessicator to Desiccator. (all instances)